{"id":2070,"date":"2024-09-06T07:38:17","date_gmt":"2024-09-06T07:38:17","guid":{"rendered":"https:\/\/thepcba.com\/?p=2070"},"modified":"2024-09-06T07:44:56","modified_gmt":"2024-09-06T07:44:56","slug":"soldering-vs-reflow-key-steps-in-pcba-process","status":"publish","type":"post","link":"https:\/\/thepcba.com\/tr\/soldering-vs-reflow-key-steps-in-pcba-process\/","title":{"rendered":"Lehimleme ve Reflow PCBA S\u00fcrecindeki Temel Ad\u0131mlar"},"content":{"rendered":"<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_82_2 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" style=\"cursor:inherit\">\u0130\u00e7indekiler<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"\u0130\u00e7erik Tablosunu De\u011fi\u015ftir\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">Ge\u00e7i\u015f<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewbox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewbox=\"0 0 24 24\" version=\"1.2\" baseprofile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/thepcba.com\/tr\/soldering-vs-reflow-key-steps-in-pcba-process\/#Introduction_of_PCBA_Process\" >PCBA S\u00fcrecinin Tan\u0131t\u0131m\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/thepcba.com\/tr\/soldering-vs-reflow-key-steps-in-pcba-process\/#Soldering_Process_Overview\" >Lehimleme S\u00fcrecine Genel Bak\u0131\u015f<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/thepcba.com\/tr\/soldering-vs-reflow-key-steps-in-pcba-process\/#Reflow_Soldering_A_Modern_Approach\" >Reflow Lehimleme: Modern Bir Yakla\u015f\u0131m<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/thepcba.com\/tr\/soldering-vs-reflow-key-steps-in-pcba-process\/#Key_Stages_of_the_Reflow_PCBA_Process\" >Reflow PCBA S\u00fcrecinin Temel A\u015famalar\u0131<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/thepcba.com\/tr\/soldering-vs-reflow-key-steps-in-pcba-process\/#Importance_of_Temperature_Control\" >S\u0131cakl\u0131k Kontrol\u00fcn\u00fcn \u00d6nemi<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/thepcba.com\/tr\/soldering-vs-reflow-key-steps-in-pcba-process\/#Selecting_the_Right_Solder_Paste_and_Flux\" >Do\u011fru Lehim Pastas\u0131 ve Flux Se\u00e7imi<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/thepcba.com\/tr\/soldering-vs-reflow-key-steps-in-pcba-process\/#Conclusion_OF_PCBA_Process\" >PCBA S\u00fcrecinin Sonucu<\/a><\/li><\/ul><\/nav><\/div>\n<h2><span class=\"ez-toc-section\" id=\"Introduction_of_PCBA_Process\"><\/span><strong><b>Giri\u015f<\/b><\/strong><strong><b>\u00a0PCBA S\u00fcrecinin<\/b><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Elektronik cihazlar\u0131n \u00fcretiminde\u00a0<a href=\"https:\/\/thepcba.com\/tr\/pcba-board-service\/\">PCBA s\u00fcreci<\/a> \u00e7ok \u00f6nemli bir a\u015famad\u0131r. Bu i\u015flem s\u0131ras\u0131nda, i\u015flevsel elektronik \u00fcr\u00fcnler olu\u015fturmak i\u00e7in bile\u015fenler bir bask\u0131l\u0131 devre kart\u0131na (PCB) tak\u0131l\u0131r. PCBA s\u00fcrecindeki iki \u00f6nemli ad\u0131m lehimleme ve yeniden ak\u0131tmad\u0131r ve her ikisi de nihai \u00fcr\u00fcn\u00fcn kalitesini ve g\u00fcvenilirli\u011fini sa\u011flamak i\u00e7in hassasiyet ve kontrol gerektirir. Bu makalede lehimleme ve yeniden ak\u0131tma s\u00fcrecinde kullan\u0131lan teknikler, ekipmanlar ve en iyi uygulamalar incelenmektedir.<\/p>\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_1960509088\">\n\t\t<a class=\"\" href=\"https:\/\/thepcba.com\/tr\/pcba-board-service\/\" >\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"690\" height=\"468\" src=\"https:\/\/thepcba.com\/wp-content\/uploads\/2024\/09\/PCBA-Process.webp\" class=\"attachment-large size-large\" alt=\"PCBA S\u00fcreci\" srcset=\"https:\/\/thepcba.com\/wp-content\/uploads\/2024\/09\/PCBA-Process.webp 690w, https:\/\/thepcba.com\/wp-content\/uploads\/2024\/09\/PCBA-Process-300x203.webp 300w, https:\/\/thepcba.com\/wp-content\/uploads\/2024\/09\/PCBA-Process-18x12.webp 18w, https:\/\/thepcba.com\/wp-content\/uploads\/2024\/09\/PCBA-Process-600x407.webp 600w\" sizes=\"(max-width: 690px) 100vw, 690px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/a>\t\t\n<style>\n#image_1960509088 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\t<div id=\"gap-743534018\" class=\"gap-element clearfix\" style=\"display:block; height:auto;\">\n\t\t\n<style>\n#gap-743534018 {\n  padding-top: 30px;\n}\n<\/style>\n\t<\/div>\n\t\n<h2><span class=\"ez-toc-section\" id=\"Soldering_Process_Overview\"><\/span><strong><b>Lehimleme S\u00fcrecine Genel Bak\u0131\u015f<\/b><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Bile\u015fenlerin PCB'ye Tak\u0131lmas\u0131<\/strong><\/p>\n<p>Lehimleme, bir havya veya dalga lehimleme makinesi kullanarak bile\u015fenlerin bir PCB'ye tak\u0131lmas\u0131n\u0131 i\u00e7erir. Havya, bile\u015fenleri panoya birle\u015ftirmek i\u00e7in lehimi eriten \u0131s\u0131t\u0131lm\u0131\u015f bir uca sahip el tipi bir alettir. Alternatif olarak, dalga lehimleme ayn\u0131 etkiyi elde etmek i\u00e7in bir dalga i\u00e7inde erimi\u015f lehim kullan\u0131r. Her iki y\u00f6ntem de bile\u015fenlere veya karta zarar vermekten ka\u00e7\u0131nmak i\u00e7in s\u0131cakl\u0131k, zaman ve bas\u0131nc\u0131n hassas bir \u015fekilde kontrol edilmesini gerektirir.<\/p>\n<p>\u00a0<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Reflow_Soldering_A_Modern_Approach\"><\/span><strong><b>Reflow Lehimleme: Modern Bir Yakla\u015f\u0131m<\/b><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Y\u00fcksek Hacimli \u00dcretimde Verimlilik ve Tutarl\u0131l\u0131k<\/strong><\/p>\n<p>Yayg\u0131n olarak daha verimli ve modern bir y\u00f6ntem olarak kabul edilen yeniden ak\u0131\u015f lehimleme, t\u00fcm kart\u0131n kontroll\u00fc bir s\u0131cakl\u0131k b\u00f6lgesinden ge\u00e7irilmesini i\u00e7erir. Bu, lehim pastas\u0131n\u0131 eriterek bile\u015fenlerin PCB'ye ba\u011flanmas\u0131n\u0131 sa\u011flar. Reflow lehimleme y\u00fcksek \u00fcretim hacimleri i\u00e7in daha uygundur ve daha y\u00fcksek kalite ve tutarl\u0131l\u0131k sa\u011flarken i\u015f\u00e7ilik maliyetlerini d\u00fc\u015f\u00fcr\u00fcr. S\u0131k\u0131 kontrol edilen s\u0131cakl\u0131k ve zaman, geleneksel lehimleme y\u00f6ntemlerine k\u0131yasla daha iyi sonu\u00e7lar al\u0131nmas\u0131n\u0131 sa\u011flar.<\/p>\n<p>\u00a0<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Key_Stages_of_the_Reflow_PCBA_Process\"><\/span><strong><b>Yeniden Ak\u0131\u015f\u0131n Temel A\u015famalar\u0131 <\/b><\/strong><strong><b>PCBA <\/b><\/strong><strong><b>S\u00fcre\u00e7<\/b><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>\u00d6n Is\u0131tma, Yeniden Ak\u0131tma ve So\u011futma A\u015famalar\u0131<\/strong><\/p>\n<p>Yeniden ak\u0131\u015f PCBA s\u00fcreci \u00fc\u00e7 ana a\u015famadan olu\u015fur: \u00f6n \u0131s\u0131tma, yeniden ak\u0131\u015f ve so\u011futma. \u0130lk olarak kart, erken erimeyi \u00f6nlemek i\u00e7in lehimin erime noktas\u0131n\u0131n hemen alt\u0131ndaki bir s\u0131cakl\u0131\u011fa kadar \u0131s\u0131t\u0131l\u0131r. Daha sonra, kart yeniden ak\u0131\u015f b\u00f6lgesinden ge\u00e7er ve burada s\u0131cakl\u0131k y\u00fckselip lehim pastas\u0131n\u0131 eriterek bile\u015fenlerin g\u00fcvenli bir \u015fekilde ba\u011flanmas\u0131n\u0131 sa\u011flar. Son olarak, kart kullan\u0131m i\u00e7in g\u00fcvenli bir s\u0131cakl\u0131\u011fa so\u011futulur.<\/p>\n<p>\u00a0<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Importance_of_Temperature_Control\"><\/span><strong><b>S\u0131cakl\u0131k Kontrol\u00fcn\u00fcn \u00d6nemi<\/b><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>G\u00fc\u00e7l\u00fc, Dayan\u0131kl\u0131 Lehim Ba\u011flant\u0131lar\u0131n\u0131n Korunmas\u0131<\/strong><\/p>\n<p>S\u0131cakl\u0131k kontrol\u00fc, PCBA s\u00fcrecinin kalitesini ve g\u00fcvenilirli\u011fini sa\u011flamak i\u00e7in \u00e7ok \u00f6nemlidir. Bu, tutarl\u0131 bir ortam yaratan s\u0131cakl\u0131k kontroll\u00fc f\u0131r\u0131nlar arac\u0131l\u0131\u011f\u0131yla sa\u011flan\u0131r. \u0130yi y\u00f6netilen bir s\u0131cakl\u0131k profili lehim ba\u011flant\u0131lar\u0131n\u0131n g\u00fc\u00e7l\u00fc ve dayan\u0131kl\u0131 olmas\u0131n\u0131 garanti ederken, zay\u0131f s\u0131cakl\u0131k kontrol\u00fc zay\u0131f veya k\u0131r\u0131lgan ba\u011flant\u0131lara neden olarak \u00fcr\u00fcn\u00fcn b\u00fct\u00fcnl\u00fc\u011f\u00fcn\u00fc tehlikeye atabilir.<\/p>\n<p>\u00a0<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Selecting_the_Right_Solder_Paste_and_Flux\"><\/span><strong><b>Do\u011fru Lehim Pastas\u0131 ve Flux Se\u00e7imi<\/b><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Malzemelerin Lehim Ba\u011flant\u0131 Kalitesi \u00dczerindeki Etkisi<\/strong><\/p>\n<p>S\u0131cakl\u0131k kontrol\u00fcne ek olarak, do\u011fru lehim pastas\u0131 ve flux se\u00e7imi de \u00e7ok \u00f6nemlidir. Lehim pastas\u0131, yeniden ak\u0131tmadan \u00f6nce PCB'ye uygulanan lehim tozu ve flux kar\u0131\u015f\u0131m\u0131d\u0131r. Flux, metal y\u00fczeylerdeki oksidasyonu ortadan kald\u0131rarak lehimin d\u00fczg\u00fcn bir \u015fekilde akmas\u0131n\u0131 ve sa\u011flam bir ba\u011f olu\u015fturmas\u0131n\u0131 sa\u011flar. Lehim pastas\u0131 ve flux se\u00e7imi, kullan\u0131lan bile\u015fenlerin t\u00fcr\u00fcne ve lehim ba\u011flant\u0131lar\u0131n\u0131n gerekli kalitesine ba\u011fl\u0131d\u0131r.<\/p>\n<p>\u00a0<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Conclusion_OF_PCBA_Process\"><\/span><strong><b>Sonu\u00e7<\/b><\/strong><strong><b>\u00a0OF PCBA S\u00fcreci<\/b><\/strong><span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Lehimleme ve yeniden ak\u0131\u015f s\u00fcreci, PCBA s\u00fcrecinin ba\u015far\u0131s\u0131n\u0131 ve dolay\u0131s\u0131yla elektronik cihazlar\u0131n kalitesini sa\u011flamada kritik bir rol oynar. Lehimleme y\u00f6ntemlerini dikkatle se\u00e7erek, hassas s\u0131cakl\u0131k kontrol\u00fcn\u00fc sa\u011flayarak ve do\u011fru malzemeleri se\u00e7erek \u00fcreticiler, elektronik end\u00fcstrisinin s\u00fcrekli artan taleplerini kar\u015f\u0131layan g\u00fcvenilir, y\u00fcksek kaliteli PCBA \u00fcr\u00fcnleri \u00fcretebilirler.<\/p>\n<p>\u00a0<\/p>\n<h3><strong><b>SIK\u00c7A SORULAN SORULAR: PCBA<\/b><\/strong><strong><b>\u00a0S\u00fcreci <\/b><\/strong><strong><b>Lehimleme ve Reflow<\/b><\/strong><\/h3>\n<p>\u00a0<\/p>\n<p><strong>1. PCBA s\u00fcreci nedir?<\/strong><br \/>PCBA (Bask\u0131l\u0131 Devre Kart\u0131 Montaj\u0131) s\u00fcreci, i\u015flevsel bir elektronik \u00fcr\u00fcn olu\u015fturmak i\u00e7in elektronik bile\u015fenlerin bir bask\u0131l\u0131 devre kart\u0131na (PCB) eklenmesini i\u00e7erir.<\/p>\n<p>\u00a0<\/p>\n<p><strong>2. PCBA'da lehimleme i\u015flemi nedir?<\/strong><br \/>Lehimleme, lehimi eriterek ve ba\u011flant\u0131lar olu\u015fturarak bile\u015fenleri PCB'ye ba\u011flamak i\u00e7in bir havya veya dalga lehimleme makinesi kullanmay\u0131 i\u00e7erir.<\/p>\n<p>\u00a0<\/p>\n<p><strong>3. Yeniden ak\u0131\u015f lehimleme nedir?<\/strong><br \/>Reflow lehimleme, PCB'nin kontroll\u00fc s\u0131cakl\u0131k b\u00f6lgelerinden ge\u00e7irildi\u011fi ve bile\u015fenleri ba\u011flamak i\u00e7in lehim pastas\u0131n\u0131n eritildi\u011fi modern bir y\u00f6ntemdir. Y\u00fcksek hacimli \u00fcretim i\u00e7in daha verimlidir.<\/p>\n<p>\u00a0<\/p>\n<p><strong>4. Yeniden ak\u0131\u015f i\u015fleminin a\u015famalar\u0131 nelerdir?<\/strong><br \/>Yeniden ak\u0131\u015f i\u015flemi \u00fc\u00e7 a\u015famadan olu\u015fur:<\/p>\n<p><strong>\u00d6n \u0131s\u0131tma<\/strong>: Kart\u0131n lehimin erime noktas\u0131n\u0131n hemen alt\u0131nda \u0131s\u0131t\u0131lmas\u0131.<\/p>\n<p><strong>Yeniden Ak\u0131\u015f<\/strong>: Lehim pastas\u0131n\u0131 eritmek i\u00e7in s\u0131cakl\u0131\u011f\u0131 y\u00fckseltmek.<\/p>\n<p><strong>So\u011futma<\/strong>: G\u00fcvenli kullan\u0131m i\u00e7in panoyu so\u011futun.<\/p>\n<p>\u00a0<\/p>\n<p><strong>5. Lehimleme ve yeniden ak\u0131\u015fta s\u0131cakl\u0131k kontrol\u00fc neden \u00f6nemlidir?<\/strong><br \/>S\u0131cakl\u0131k kontrol\u00fc, g\u00fc\u00e7l\u00fc ve dayan\u0131kl\u0131 lehim ba\u011flant\u0131lar\u0131 sa\u011flayarak \u00fcr\u00fcn g\u00fcvenilirli\u011fini tehlikeye atabilecek zay\u0131f veya k\u0131r\u0131lgan ba\u011flant\u0131lar\u0131 \u00f6nler.<\/p>\n<p>\u00a0<\/p>\n<p><strong>6. Lehim pastas\u0131 ve flux nas\u0131l bir rol oynar?<\/strong><br \/>Lehim tozu ve flux kar\u0131\u015f\u0131m\u0131 olan lehim pastas\u0131, oksidasyonu gidermek ve g\u00fc\u00e7l\u00fc lehim ba\u011flant\u0131lar\u0131 olu\u015fturmak i\u00e7in PCB'ye uygulan\u0131r. Pasta ve flux se\u00e7imi bile\u015fenlere ve istenen kaliteye ba\u011fl\u0131d\u0131r.<\/p>\n<p>\u00a0<\/p>\n<p><strong>7.Yeniden ak\u0131\u015f lehimlemenin geleneksel y\u00f6ntemlere g\u00f6re avantajlar\u0131 nelerdir?<\/strong><br \/>Reflow lehimleme daha verimli, uygun maliyetli ve kontroll\u00fc s\u0131cakl\u0131\u011f\u0131 ve daha y\u00fcksek \u00fcretim kapasitesi sayesinde daha iyi kalite ve tutarl\u0131l\u0131k sa\u011flar.<\/p>\n<p>\u00a0<\/p>\n<p><strong>8. \u00dcreticiler PCBA s\u00fcrecinde kaliteyi nas\u0131l sa\u011flayabilir?<\/strong><br \/>\u00dcreticiler, uygun s\u0131cakl\u0131k kontrol\u00fcn\u00fc sa\u011flayarak, uygun lehim pastas\u0131 ve flux kullanarak ve do\u011fru lehimleme y\u00f6ntemini se\u00e7erek g\u00fcvenilir ve y\u00fcksek kaliteli PCBA \u00fcr\u00fcnleri \u00fcretebilirler.<\/p>","protected":false},"excerpt":{"rendered":"<p>PCBA S\u00fcrecinin Tan\u0131t\u0131m\u0131 Elektronik cihazlar\u0131n \u00fcretiminde PCBA s\u00fcreci \u00e7ok \u00f6nemli bir a\u015famad\u0131r. Bu i\u015flem s\u0131ras\u0131nda, i\u015flevsel elektronik \u00fcr\u00fcnler olu\u015fturmak i\u00e7in bile\u015fenler bir bask\u0131l\u0131 devre kart\u0131na (PCB) tak\u0131l\u0131r. PCBA s\u00fcrecindeki iki \u00f6nemli ad\u0131m lehimleme ve yeniden ak\u0131tmad\u0131r ve her ikisi de nihai \u00fcr\u00fcn\u00fcn [...] sa\u011flamak i\u00e7in hassasiyet ve kontrol gerektirir.","protected":false},"author":1,"featured_media":2072,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"_links":{"self":[{"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/posts\/2070"}],"collection":[{"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/comments?post=2070"}],"version-history":[{"count":4,"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/posts\/2070\/revisions"}],"predecessor-version":[{"id":2075,"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/posts\/2070\/revisions\/2075"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/media\/2072"}],"wp:attachment":[{"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/media?parent=2070"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/categories?post=2070"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/thepcba.com\/tr\/wp-json\/wp\/v2\/tags?post=2070"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}