{"id":1880,"date":"2024-08-14T02:09:41","date_gmt":"2024-08-14T02:09:41","guid":{"rendered":"https:\/\/thepcba.com\/?p=1880"},"modified":"2024-08-14T08:24:29","modified_gmt":"2024-08-14T08:24:29","slug":"challenges-and-solutions-for-pcb-thermal-management","status":"publish","type":"post","link":"https:\/\/thepcba.com\/cs\/challenges-and-solutions-for-pcb-thermal-management\/","title":{"rendered":"V\u00fdzvy a \u0159e\u0161en\u00ed pro tepeln\u00fd management desek plo\u0161n\u00fdch spoj\u016f"},"content":{"rendered":"<div class=\"row\"  id=\"row-159408957\">\n\n\t<div id=\"col-276338726\" class=\"col medium-6 small-12 large-6\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n<div id=\"ez-toc-container\" class=\"ez-toc-v2_0_68_1 counter-hierarchy ez-toc-counter ez-toc-grey ez-toc-container-direction\">\n<div class=\"ez-toc-title-container\">\n<p class=\"ez-toc-title\" >Obsah<\/p>\n<span class=\"ez-toc-title-toggle\"><a href=\"#\" class=\"ez-toc-pull-right ez-toc-btn ez-toc-btn-xs ez-toc-btn-default ez-toc-toggle\" aria-label=\"P\u0159epnut\u00ed tabulky obsahu\"><span class=\"ez-toc-js-icon-con\"><span class=\"\"><span class=\"eztoc-hide\" style=\"display:none;\">P\u0159ep\u00edna\u010d<\/span><span class=\"ez-toc-icon-toggle-span\"><svg style=\"fill: #999;color:#999\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" class=\"list-377408\" width=\"20px\" height=\"20px\" viewbox=\"0 0 24 24\" fill=\"none\"><path d=\"M6 6H4v2h2V6zm14 0H8v2h12V6zM4 11h2v2H4v-2zm16 0H8v2h12v-2zM4 16h2v2H4v-2zm16 0H8v2h12v-2z\" fill=\"currentColor\"><\/path><\/svg><svg style=\"fill: #999;color:#999\" class=\"arrow-unsorted-368013\" xmlns=\"http:\/\/www.w3.org\/2000\/svg\" width=\"10px\" height=\"10px\" viewbox=\"0 0 24 24\" version=\"1.2\" baseprofile=\"tiny\"><path d=\"M18.2 9.3l-6.2-6.3-6.2 6.3c-.2.2-.3.4-.3.7s.1.5.3.7c.2.2.4.3.7.3h11c.3 0 .5-.1.7-.3.2-.2.3-.5.3-.7s-.1-.5-.3-.7zM5.8 14.7l6.2 6.3 6.2-6.3c.2-.2.3-.5.3-.7s-.1-.5-.3-.7c-.2-.2-.4-.3-.7-.3h-11c-.3 0-.5.1-.7.3-.2.2-.3.5-.3.7s.1.5.3.7z\"\/><\/svg><\/span><\/span><\/span><\/a><\/span><\/div>\n<nav><ul class='ez-toc-list ez-toc-list-level-1' ><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-1\" href=\"https:\/\/thepcba.com\/cs\/challenges-and-solutions-for-pcb-thermal-management\/#Introduction\" title=\"\u00davod\">\u00davod<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-2\" href=\"https:\/\/thepcba.com\/cs\/challenges-and-solutions-for-pcb-thermal-management\/#Increasing_Power_Density\" title=\"Zvy\u0161ov\u00e1n\u00ed hustoty v\u00fdkonu\">Zvy\u0161ov\u00e1n\u00ed hustoty v\u00fdkonu<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-3\" href=\"https:\/\/thepcba.com\/cs\/challenges-and-solutions-for-pcb-thermal-management\/#Balancing_Thermal_and_Electrical_Performance\" title=\"Vyv\u00e1\u017een\u00ed tepeln\u00e9ho a elektrick\u00e9ho v\u00fdkonu\">Vyv\u00e1\u017een\u00ed tepeln\u00e9ho a elektrick\u00e9ho v\u00fdkonu<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-4\" href=\"https:\/\/thepcba.com\/cs\/challenges-and-solutions-for-pcb-thermal-management\/#Manufacturing_and_Assembly_Challenges\" title=\"Probl\u00e9my p\u0159i v\u00fdrob\u011b a mont\u00e1\u017ei\">Probl\u00e9my p\u0159i v\u00fdrob\u011b a mont\u00e1\u017ei<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-5\" href=\"https:\/\/thepcba.com\/cs\/challenges-and-solutions-for-pcb-thermal-management\/#Advancements_in_Thermal_Management_Technology\" title=\"Pokroky v technologii tepeln\u00e9ho managementu\">Pokroky v technologii tepeln\u00e9ho managementu<\/a><\/li><li class='ez-toc-page-1 ez-toc-heading-level-2'><a class=\"ez-toc-link ez-toc-heading-6\" href=\"https:\/\/thepcba.com\/cs\/challenges-and-solutions-for-pcb-thermal-management\/#Conclusion\" title=\"Z\u00e1v\u011br\">Z\u00e1v\u011br<\/a><ul class='ez-toc-list-level-3' ><li class='ez-toc-heading-level-3'><a class=\"ez-toc-link ez-toc-heading-7\" href=\"https:\/\/thepcba.com\/cs\/challenges-and-solutions-for-pcb-thermal-management\/#FAQs\" title=\"Nej\u010dast\u011bj\u0161\u00ed dotazy\">Nej\u010dast\u011bj\u0161\u00ed dotazy<\/a><\/li><\/ul><\/li><\/ul><\/nav><\/div>\n<h2><span class=\"ez-toc-section\" id=\"Introduction\"><\/span>\u00davod<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Vzhledem k tomu, \u017ee elektronick\u00e1 za\u0159\u00edzen\u00ed jsou st\u00e1le slo\u017eit\u011bj\u0161\u00ed a v\u00fdkonn\u011bj\u0161\u00ed, st\u00e1v\u00e1 se \u00fa\u010dinn\u00fd tepeln\u00fd management kritickou v\u00fdzvou p\u0159i n\u00e1vrhu a mont\u00e1\u017ei desek plo\u0161n\u00fdch spoj\u016f (PCB). \u0158\u00edzen\u00ed tepla generovan\u00e9ho elektronick\u00fdmi sou\u010d\u00e1stkami s vysokou hustotou je nezbytn\u00e9 pro zachov\u00e1n\u00ed v\u00fdkonu, prevenci p\u0159eh\u0159\u00e1t\u00ed a zaji\u0161t\u011bn\u00ed dlouh\u00e9 \u017eivotnosti za\u0159\u00edzen\u00ed. Tento \u010dl\u00e1nek se zab\u00fdv\u00e1 kl\u00ed\u010dov\u00fdmi v\u00fdzvami v oblasti tepeln\u00e9ho managementu desek plo\u0161n\u00fdch spoj\u016f a p\u0159edstavuje \u0159e\u0161en\u00ed, kter\u00e1 tyto probl\u00e9my \u0159e\u0161\u00ed.<\/p>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n\n\t<div id=\"col-1817522138\" class=\"col medium-6 small-12 large-6\"  >\n\t\t\t\t<div class=\"col-inner\"  >\n\t\t\t\n\t\t\t\n\t<div class=\"img has-hover x md-x lg-x y md-y lg-y\" id=\"image_249869224\">\n\t\t\t\t\t\t\t\t<div class=\"img-inner dark\" >\n\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"594\" height=\"482\" src=\"https:\/\/thepcba.com\/wp-content\/uploads\/2024\/08\/u1611999078989773270fm253fmtautoapp138fJPEG.jpg\" class=\"attachment-large size-large\" alt=\"Tepeln\u00fd management PCB\" srcset=\"https:\/\/thepcba.com\/wp-content\/uploads\/2024\/08\/u1611999078989773270fm253fmtautoapp138fJPEG.jpg 594w, https:\/\/thepcba.com\/wp-content\/uploads\/2024\/08\/u1611999078989773270fm253fmtautoapp138fJPEG-300x243.jpg 300w, https:\/\/thepcba.com\/wp-content\/uploads\/2024\/08\/u1611999078989773270fm253fmtautoapp138fJPEG-15x12.jpg 15w\" sizes=\"(max-width: 594px) 100vw, 594px\" \/>\t\t\t\t\t\t\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t\t\t\n<style>\n#image_249869224 {\n  width: 100%;\n}\n<\/style>\n\t<\/div>\n\t\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\n\t\n<\/div>\n<h2><span class=\"ez-toc-section\" id=\"Increasing_Power_Density\"><\/span>Zvy\u0161ov\u00e1n\u00ed hustoty v\u00fdkonu<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>\u0158e\u0161en\u00ed problematiky generov\u00e1n\u00ed tepla v kompaktn\u00edch za\u0159\u00edzen\u00edch<\/strong><\/p>\n<p>Jednou z hlavn\u00edch v\u00fdzev v oblasti tepeln\u00e9ho managementu desek plo\u0161n\u00fdch spoj\u016f je rostouc\u00ed hustota v\u00fdkonu modern\u00edch elektronick\u00fdch za\u0159\u00edzen\u00ed. S t\u00edm, jak se komponenty, jako jsou CPU, GPU a pam\u011b\u0165ov\u00e9 \u010dipy, st\u00e1vaj\u00ed v\u00fdkonn\u011bj\u0161\u00edmi a kompaktn\u011bj\u0161\u00edmi, m\u016f\u017ee teplo, kter\u00e9 generuj\u00ed, p\u0159es\u00e1hnout kapacitu tradi\u010dn\u00edch chladic\u00edch mechanism\u016f. To m\u016f\u017ee v\u00e9st ke sn\u00ed\u017een\u00ed v\u00fdkonu, vy\u0161\u0161\u00ed spot\u0159eb\u011b energie a potenci\u00e1ln\u00edmu selh\u00e1n\u00ed za\u0159\u00edzen\u00ed. \u0158e\u0161en\u00ed tohoto probl\u00e9mu zahrnuje pou\u017eit\u00ed materi\u00e1l\u016f tepeln\u00fdch rozhran\u00ed, chladi\u010d\u016f a tepeln\u00fdch pr\u016fchodek pro \u00fa\u010dinn\u00fd odvod tepla.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Balancing_Thermal_and_Electrical_Performance\"><\/span>Vyv\u00e1\u017een\u00ed tepeln\u00e9ho a elektrick\u00e9ho v\u00fdkonu<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Optimalizace odvodu tepla i integrity sign\u00e1lu<\/strong><\/p>\n<p>Dal\u0161\u00ed z\u00e1sadn\u00ed v\u00fdzvou je vyv\u00e1\u017een\u00ed tepeln\u00e9ho v\u00fdkonu s elektrick\u00fdm v\u00fdkonem. S rostouc\u00ed slo\u017eitost\u00ed elektronick\u00fdch za\u0159\u00edzen\u00ed mus\u00ed konstrukt\u00e9\u0159i optimalizovat jak tepeln\u00fd management, tak elektrickou \u00fa\u010dinnost. To zahrnuje pe\u010dliv\u00e9 zv\u00e1\u017een\u00ed um\u00edst\u011bn\u00ed sou\u010d\u00e1stek, jejich sm\u011brov\u00e1n\u00ed a v\u00fdb\u011br materi\u00e1l\u016f, aby se zajistilo, \u017ee tepeln\u00e9 \u0159\u00edzen\u00ed neohroz\u00ed elektrick\u00fd v\u00fdkon. Nap\u0159\u00edklad za\u010dlen\u011bn\u00ed tepeln\u00fdch pr\u016fchodek m\u016f\u017ee pomoci \u0159\u00eddit teplo a z\u00e1rove\u0148 zlep\u0161it integritu elektrick\u00e9ho sign\u00e1lu.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Manufacturing_and_Assembly_Challenges\"><\/span>Probl\u00e9my p\u0159i v\u00fdrob\u011b a mont\u00e1\u017ei<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Orientace ve slo\u017eitosti a n\u00e1kladech na tepeln\u00e1 \u0159e\u0161en\u00ed<\/strong><\/p>\n<p>Integrace pokro\u010dil\u00fdch technik tepeln\u00e9ho managementu do n\u00e1vrhu desek plo\u0161n\u00fdch spoj\u016f p\u0159edstavuje praktick\u00e9 v\u00fdzvy souvisej\u00edc\u00ed s v\u00fdrobou a mont\u00e1\u017e\u00ed. Implementace t\u011bchto \u0159e\u0161en\u00ed \u010dasto vy\u017eaduje specializovan\u00e9 vybaven\u00ed a odborn\u00e9 znalosti, co\u017e m\u016f\u017ee zv\u00fd\u0161it v\u00fdrobn\u00ed n\u00e1klady a prodlou\u017eit dodac\u00ed lh\u016fty. Krom\u011b toho m\u016f\u017ee za\u010dlen\u011bn\u00ed komponent tepeln\u00e9ho managementu zkomplikovat v\u00fdrobn\u00ed proces a potenci\u00e1ln\u011b ovlivnit v\u00fdt\u011b\u017enost a spolehlivost.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Advancements_in_Thermal_Management_Technology\"><\/span>Pokroky v technologii tepeln\u00e9ho managementu<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p><strong>Vyu\u017eit\u00ed nov\u00fdch materi\u00e1l\u016f a technik<\/strong><\/p>\n<p>Navzdory t\u011bmto v\u00fdzv\u00e1m p\u0159ipravuje pokrok v technologii desek plo\u0161n\u00fdch spoj\u016f a tepeln\u00e9m managementu cestu k \u00fa\u010dinn\u011bj\u0161\u00edm a spolehliv\u011bj\u0161\u00edm elektronick\u00fdm za\u0159\u00edzen\u00edm. Pou\u017eit\u00ed modern\u00edch materi\u00e1l\u016f, jako je vysoce vodiv\u00e1 m\u011b\u010f a hlin\u00edk pro chladi\u010de a materi\u00e1ly tepeln\u00fdch rozhran\u00ed, zlep\u0161ilo odvod tepla. K v\u00fdvoji kompaktn\u011bj\u0161\u00edch a v\u00fdkonn\u011bj\u0161\u00edch za\u0159\u00edzen\u00ed p\u0159isp\u00edvaj\u00ed tak\u00e9 inovace, jako je 3D stohov\u00e1n\u00ed a techniky vestav\u011bn\u00e9ho chlazen\u00ed.<\/p>\n<h2><span class=\"ez-toc-section\" id=\"Conclusion\"><\/span>Z\u00e1v\u011br<span class=\"ez-toc-section-end\"><\/span><\/h2>\n<p>Vzhledem k rostouc\u00ed hustot\u011b v\u00fdkonu a slo\u017eitosti desek plo\u0161n\u00fdch spoj\u016f je pro v\u00fdvoj modern\u00edch elektronick\u00fdch za\u0159\u00edzen\u00ed z\u00e1sadn\u00ed \u00fa\u010dinn\u00fd tepeln\u00fd management. \u0158e\u0161en\u00ed probl\u00e9m\u016f spojen\u00fdch s produkc\u00ed tepla, vyv\u00e1\u017een\u00edm tepeln\u00e9ho a elektrick\u00e9ho v\u00fdkonu a p\u0159ekon\u00e1n\u00edm v\u00fdrobn\u00edch p\u0159ek\u00e1\u017eek je z\u00e1sadn\u00ed pro zaji\u0161t\u011bn\u00ed spolehliv\u00e9ho provozu a dlouh\u00e9 \u017eivotnosti za\u0159\u00edzen\u00ed. Technologick\u00fd pokrok nad\u00e1le vede ke zlep\u0161ov\u00e1n\u00ed tepeln\u00e9ho managementu, co\u017e umo\u017e\u0148uje vytv\u00e1\u0159et v\u00fdkonn\u011bj\u0161\u00ed, efektivn\u011bj\u0161\u00ed a spolehliv\u011bj\u0161\u00ed elektronick\u00e1 za\u0159\u00edzen\u00ed. S rostouc\u00ed slo\u017eitost\u00ed za\u0159\u00edzen\u00ed a rostouc\u00edmi po\u017eadavky na v\u00fdkon bude efektivn\u00ed tepeln\u00fd management i nad\u00e1le kl\u00ed\u010dov\u00fdm bodem p\u0159i n\u00e1vrhu a v\u00fdrob\u011b desek plo\u0161n\u00fdch spoj\u016f.<\/p>\n<hr \/>\n<h3><span class=\"ez-toc-section\" id=\"FAQs\"><\/span>Nej\u010dast\u011bj\u0161\u00ed dotazy<span class=\"ez-toc-section-end\"><\/span><\/h3>\n<p><strong>Ot\u00e1zka: Co je hlavn\u00ed v\u00fdzvou v oblasti tepeln\u00e9ho managementu desek plo\u0161n\u00fdch spoj\u016f?<\/strong><br \/>Odpov\u011b\u010f: Hlavn\u00edm probl\u00e9mem je zvl\u00e1dnut\u00ed rostouc\u00ed hustoty v\u00fdkonu modern\u00edch elektronick\u00fdch za\u0159\u00edzen\u00ed, kter\u00e1 m\u016f\u017ee p\u0159et\u00ed\u017eit tradi\u010dn\u00ed chladic\u00ed mechanismy a v\u00e9st k probl\u00e9m\u016fm s v\u00fdkonem nebo k poruch\u00e1m.<\/p>\n<p><strong>Ot\u00e1zka: Jak mohou konstrukt\u00e9\u0159i \u0159e\u0161it probl\u00e9m vysok\u00e9 hustoty v\u00fdkonu v desk\u00e1ch plo\u0161n\u00fdch spoj\u016f?<\/strong><br \/>Odpov\u011b\u010f: Konstrukt\u00e9\u0159i mohou pou\u017e\u00edvat pokro\u010dil\u00e9 techniky tepeln\u00e9ho managementu, jako jsou materi\u00e1ly tepeln\u00fdch rozhran\u00ed, chladi\u010de a tepeln\u00e9 pr\u016fchodky, aby \u00fa\u010dinn\u011b odv\u00e1d\u011bli teplo.<\/p>\n<p><strong>Ot\u00e1zka: Jak\u00fd vliv m\u00e1 vyv\u00e1\u017een\u00ed tepeln\u00e9ho a elektrick\u00e9ho v\u00fdkonu p\u0159i n\u00e1vrhu desek plo\u0161n\u00fdch spoj\u016f?<\/strong><br \/>Odpov\u011b\u010f: Vyv\u00e1\u017een\u00ed tepeln\u00e9ho a elektrick\u00e9ho v\u00fdkonu zahrnuje optimalizaci rozm\u00edst\u011bn\u00ed komponent, jejich veden\u00ed a v\u00fdb\u011br materi\u00e1lu, aby se zajistilo, \u017ee \u00fa\u010dinn\u00fd odvod tepla neohroz\u00ed integritu elektrick\u00e9ho sign\u00e1lu.<\/p>\n<p><strong>Ot\u00e1zka: Jak\u00e9 praktick\u00e9 v\u00fdzvy jsou spojeny s pokro\u010dil\u00fdmi technikami tepeln\u00e9ho managementu?<\/strong><br \/>Odpov\u011b\u010f: Praktick\u00e9 probl\u00e9my zahrnuj\u00ed pot\u0159ebu specializovan\u00e9ho vybaven\u00ed a odborn\u00fdch znalost\u00ed, zv\u00fd\u0161en\u00e9 v\u00fdrobn\u00ed n\u00e1klady, prodlou\u017een\u00e9 dodac\u00ed lh\u016fty a dal\u0161\u00ed slo\u017eitost v\u00fdrobn\u00edho procesu.<\/p>\n<p><strong>Ot\u00e1zka: Jak pokrok v technologii tepeln\u00e9ho managementu zlep\u0161uje n\u00e1vrh desek plo\u0161n\u00fdch spoj\u016f?<\/strong><br \/>Odpov\u011b\u010f: Pokroky, jako jsou vysoce vodiv\u00e9 materi\u00e1ly, 3D stohov\u00e1n\u00ed a vestav\u011bn\u00e9 chladic\u00ed techniky, zlep\u0161uj\u00ed odvod tepla a umo\u017e\u0148uj\u00ed vytv\u00e1\u0159et kompaktn\u011bj\u0161\u00ed a v\u00fdkonn\u011bj\u0161\u00ed za\u0159\u00edzen\u00ed.<\/p>","protected":false},"excerpt":{"rendered":"<p>Zvy\u0161uj\u00edc\u00ed se hustota v\u00fdkonu \u0158e\u0161en\u00ed probl\u00e9mu generov\u00e1n\u00ed tepla v kompaktn\u00edch za\u0159\u00edzen\u00edch Jednou z hlavn\u00edch v\u00fdzev v oblasti tepeln\u00e9ho managementu desek plo\u0161n\u00fdch spoj\u016f je rostouc\u00ed hustota v\u00fdkonu modern\u00edch elektronick\u00fdch za\u0159\u00edzen\u00ed. Jak se komponenty, jako jsou CPU, GPU a pam\u011b\u0165ov\u00e9 \u010dipy, st\u00e1vaj\u00ed v\u00fdkonn\u011bj\u0161\u00edmi a kompaktn\u011bj\u0161\u00edmi, teplo, kter\u00e9 generuj\u00ed, m\u016f\u017ee p\u0159es\u00e1hnout kapacitu tradi\u010dn\u00edch chladic\u00edch mechanism\u016f. To m\u016f\u017ee v\u00e9st k [...]","protected":false},"author":1,"featured_media":1924,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"_links":{"self":[{"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/posts\/1880"}],"collection":[{"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/comments?post=1880"}],"version-history":[{"count":2,"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/posts\/1880\/revisions"}],"predecessor-version":[{"id":1925,"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/posts\/1880\/revisions\/1925"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/media\/1924"}],"wp:attachment":[{"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/media?parent=1880"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/categories?post=1880"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/thepcba.com\/cs\/wp-json\/wp\/v2\/tags?post=1880"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}